Volume 4 Number 1 (Feb. 2014)
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IJEEEE 2014 Vol.4(1): 47-51 ISSN: 2010-3654
DOI: 10.7763/IJEEEE.2014.V4.300

Security Analysis and Enhanced Construction on ECDLP-Based Proxy Blind Signature Scheme

Chih-Hung Wang and Meng-Zhe Liao
Abstract— Nowadays, the proxy blind signature is an important issue in E-commerce system. In the proxy blind signature scheme, the delegation relationship can be established between the original signer and the proxy signer. That means an original signer, due to the special reasons, delegates his signing capability to a proxy signer who can thus sign a message on behalf of the original signer. The blindness property indicates that the proxy signer does not know the content of his signing message. In the past years, many researchers have proposed proxy blind signature schemes based on DLP (Discrete Logarithm Problem) and ECDLP (Elliptic Curve DLP). This paper demonstrates that Alghazzawi et al.’s and Pradhan-Mohapatra’s proxy blind signature schemes based on ECDLP are insecure because both of them do not meet the unlinkability property. Therefore, we present an enhanced construction based on the ECDLP which can satisfy all security requirements of the proxy blind signature.

Index Terms— Proxy blind signature, discrete logarithm problem, elliptic curve, cryptography, network security.

Chih-Hung Wang and Meng-Zhe Liao are with the Department of Computer Science and Information Engineering, National Chiayi University, Chiayi City 60004, Taiwan (e-mail: wangch@mail.ncyu.edu.tw, s1000451@mail.ncyu.edu.tw).

Cite: Chih-Hung Wang and Meng-Zhe Liao, " Security Analysis and Enhanced Construction on ECDLP-Based Proxy Blind Signature Scheme," International Journal of e-Education, e-Business, e-Management and e-Learning vol. 4, no. 1, pp. 47-51, 2014.

General Information

ISSN: 2010-3654 (Online)
Abbreviated Title: Int. J. e-Educ. e-Bus. e-Manag. e-Learn.
Frequency: Quarterly
Editor-in-Chief: Prof. Kuan-Chou Chen
Executive Editor: Ms. Nancy Lau
Abstracting/ Indexing: EBSCO, Google Scholar, Electronic Journals Library, QUALIS, ProQuest, EI (INSPEC, IET)
E-mail: ijeeee@iap.org
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